| Item |
Process |
Chemical name |
Purpose |
| Electro-Plating |
Nickle |
E-Form(sulfamic acid Ni) |
PCB, Electronic parts, High-grade sulfamic acid |
| Ni Sulfate |
PCB, Electronic parts (Liquid, Solid) |
| Ni Chloride |
PCB, Electronic parts |
| SN-20 |
S-free Ni plating additive for a corrosion resistance |
| SN-100 |
Stress control additive for electroforming sulfamic acid Ni plating |
| SN-500 |
Brightener for sulfamic acid Ni plating |
| SN-1000, 2000 |
1st, 2nd Brightener for sulfamic acid Ni plating |
| NP-A |
Anti-pit agent with little bubber(Air&Machine stirring) |
| SN-pH |
Additive dropping pH in sulfamic acid Ni plating |
| Silver |
Shine silver A,B |
Organic additive for high shine plating (LED, Lead frame) |
| Sillux 1000 A,B |
Additive containing metal for high shine plating(LED, Lead frame) |
| KS-700 Process |
High speed Ag plating for Lead Frame |
| ACID-SILVER 100 |
Non-CN Acid Ag plating (LED, L/F) |
| Palladium |
Pdpro-90 |
Alloy plating for alloy Pd/Ni |
| Gold |
KG-120 Process |
Electro Soft/Hard Au plating for wire bonding |
| KG-200 Process |
High speed acid hard Au plating |
| KG-250 Process |
High shine Au plating for alloy Co (Barrel, Rack) |
| KG-300 Process |
Au Plating wirh Ni for connector |
| KG-500 (Additive E) |
Au Plating of connector to make barrier |
| Copper |
Copper pyrophosphate |
Copper pyrophosphate conc |
| CPS-2, CP-3 |
Brightener, wetting agent for Copper pyrophosphate plating |
| TSV-100, 200, 300 |
Additive of acid copper plating for TSV |
| Tin |
SN, M1, M2 |
Brightener, Non-brightener for Sulfate Sn plating |
| Platinum |
PPT-100 |
Pt plating |
| Alloy |
Sn/Cu/Zn Alloy |
Ternary alloy Ni-free (CN Base) |
| PSN-640 |
Alloy SN/Ni plating |
| Electroless-Plating |
Catalyst |
CP-20 |
Catalyst for electroless Pd plating(1000 ppm/L) |
| ENIG |
FPEN-400 |
Electroless Ni plating for Flexible-PCB |
| FPIG-400 |
Electroless Au plating for Flexible-PCB |
| ENEPIG |
- |
Electroless Ni/Pd/Au plating for Flexible-PCB |
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