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> Product > Chemical for electronic parts |
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Process |
Chemical name |
Purpose |
Substrate (COF/PCB/BGA/BOC) |
DMP-100 |
Ni, Ni-Cr Sputter seed remover |
PTC-90 |
T-Coating material for protecting Lead of COF |
FPE-100 |
New etching additive |
PIE-2000 |
Poly imide(PI) etching (Kapton type) |
FPC-20, TC-100 |
Tank organic cleaner |
TSP (Touch Screen Panel) |
PITE-100, 150 |
Crystal ITO etchant |
TWME-600, PAM-100 |
Ag/Mo, APC metal etchant |
TWME-810 |
Ag/Ni/Cr metal etchant |
TME-1000 |
Ni-Cr/Cu/Ni-Cr metal etchant |
TNCE-100 |
Ni/Cr metal etchant |
TME-250, TME-400 |
Cu/Ni metal etchant |
PWE-100 |
APC metal etchant |
TWME-300, PANE-100, PANE-160 |
Ag nano wire etchant |
PCPE-100 |
Conductivity molecule etchant |
PCM-500, 620 |
Cu mesh etchant |
CIE-100 |
ITO-Cu etchant |
CIE-200 |
ITO etchant |
PAMS-10 |
Ag-Mo seed etchant |
CSR-200 |
Glass Resin&Paste Cleaner |
SGE-300 |
Graphene substrating ITO etchant |
Display |
OMEC S-19 |
OLED MASK Cleaner |
PMC-100, SOC-100 |
Phospher R,G,B remover for OLED MASK Remover |
PNR-100 |
PR protecting Wafer |
PHM-1 |
LED Wafer adhesive WAX |
PPGC-200 |
Organic, inorganic particle cleaner of hardness glass |
PGE-310 |
Hardned glass etchant |
PPMC-130 |
Photo Mask cleaner |
OMECSOL-160, 310 |
OLED Mask cleaner |
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