| Item |
Process |
Chemical name |
Purpose |
| Pre-treatment |
Degreasing |
AI-1230, AI-1240 |
High speed alkali degreasing for electro, dipping |
| ST-198, 415 |
Liquid alkali degreasing for electro, dipping |
| RCS-21, BSP-100 |
High speed liquid alkali degreasing for electro, dipping |
| PAC-200K, SAC-200 |
PCB, TAB, BGA acid degreasing |
| PAC-310X |
PCB, TAB, BGA, LED, AI neuter degreasing |
| PCC-600 |
Multi type Cu plating degreasing |
Chemical
polishing |
KCE-40 |
Alloy Cu Acid cleaning with H2O2 |
| KCE-50 |
Connecter, LED L/F Chemical polishing |
| KCE-60 |
Alloy Cu/Ti Chemical polishing |
| KCE-1000 |
Alloy Fe |
| KCE-500 |
Soft etching with H2O2 for PSR treatment |
| KCE-300 |
COF mild etching with FeCl2 |
| MFE-20 |
3 Liquid additive with H2O2 |
| MFE-5000, CPE-750 |
Soft etching with H2O2 |
| MFE-6000 |
PCB half etching with H2O2 |
| NPE-300, SPS |
PCB soft etching with Na2O8S2 |
| CPL-100 |
Alloy Fe Burr remover with H2O2 |
| PALE-100 |
Al half etchant |
| Post-treatment |
Anti-RBO |
AR-1(AT), AR-21, HI-200 |
Lead-Frame Anti-RBO |
| TR-1 |
PPF Lead frame Anti-RBO |
| LR-10, AR-1 |
LED Lead frame Anti-RBO |
| Anti-Immersion |
PW-660 |
Ag plating Anti-immersion |
| Anti-Tarnish(Ag) |
SAT-200 |
Ag Anti-tarnish |
| SAT-500 |
Ag plating Heat-resisting |
| Rinse improver |
Short Rinse |
Improve rinsing power after plating |
| Anti-Tarnish(Cu) |
CB-2001 |
Cu Anti-tarnish |
| ES-Cu |
Anti-tarnish for electron parts, plating |
| CAT |
Anti-tarnish for electron parts, plating |
| Sealing agent |
Au-XW |
PCB Au plating sealing agent |
| Au-Sealler 100 |
Connector Au plating sealing agent |
| ANTI CRS-100 |
Hard-Au plating sealing agent |
| PAS-200 |
Au plating electro sealing agent |
| GOS-419 |
Au plating dipping sealing agent |
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