Process |
Chemical |
purpose |
Feature |
Dedreasing /Cleaning |
PAC-200 |
Acid cleaner for PCB, TAB, BGA |
Acid cleaner for PCB process before or after Cu plating to washing on the Cu surface. Useful for removing finger print, oxide PR residue. |
PAC-310 |
Neutral claener PCB |
Neutral claener PCB process before or after Cu plating to washing on the Cu surface. Useful for removing finger print, oxide PR residue |
Soft etching |
CPE-750 |
PCB soft Etchant (Hydrogen peroxide type) |
Soft Etchant for PCB and suited for pretreating of Dry film lamination |
NPE-300 |
Sodium persulfate type Etchant |
Sodium persulfate type soft Etchant for the pretreatment of PCB through-Hole before plating |
SPS |
Sodium persulfate type Etchant |
Sodium persulfate type soft Etchant for Cu electroless plating process |
KCE-500 |
PCB soft Etchant (Hydrogen peroxide type) |
Soft Etchant for PCB process, preteatment of Dry film laminating |