| Display Manufacturing | OMEC-S19, 100, C13 |
OLED FMM Mask Cleaner (Organic Contaminants) |
| OMECSOL-162 |
OLED OMM Mask Cleaner (Organic & Inorganic Contaminants) |
| OMECSOL-300 |
OLED OMM Mask Cleaner (Inorganic Contaminants) - Acid Type |
| AOC-100 |
OLED OMM Mask Cleaner (Inorganic Contaminants) - Alkaline Type |
| OMSC-100 |
Metal Mask Carbide Cleaner |
| CMSE-100 |
Metal Mask Etchant (Cr) |
| MSE-100 |
Metal Mask Etchant (MoSi) |
| SOC-100 |
OLED Mask Phosphor Remover |
| PCB / PKG Manufacturing | E-Form, NSEC-100 |
High-purity Nickel Sulfamate for PCB and Electronic Materials |
| Nickel Sulfate, Nickel Chloride, Boric Acid |
For PCB and Electronic Materials (Liquid & Solid Types) |
| Ni Crown, Pellet |
Nickel Anode |
| SN-20 |
Corrosion Resistance Additive for Nickel Sulfamate (Sulfur Free) |
| SN-100 |
Nickel Sulfamate Plating Stress Reliever |
| SN-500 |
Nickel Sulfamate 1-Component Brightener |
| SN-1000, 2000 |
Nickel Sulfamate 2-Component Brightener |
| NP-A |
Nickel Sulfamate Pit Inhibitor (For Air & Mechanical Agitation) |
| KG-120 Process |
Au Electroplating Solution (Soft Gold, Wire Bonding) |
| KG-200 Process |
Au Electroplating Solution (Hard Gold, Cobalt Base) |
| KG-250 Process |
Au Electroplating Solution (Barrel, Rack Low-Speed, Cobalt Base) |
| KG-300 Process |
Au Electroplating Solution (For Connectors, Nickel Base) |
| Strike Process |
Au Electroplating Solution (Strike Plating) |
| Sillux 1000 A, B |
Ag High-Gloss Additive for Plating (Lead Frame, Metal Substrates) |
| KS-700 Process |
Ag Electroplating Solution (IC, Wire Bonding) |
| SN, M1, M2 |
Sn Electroplating Solution Brightener (Semi-Bright/Bright, Sulfate Type) |
| Semiconductor Manufacturing | WTE-100 |
Wafer Ti Etchant (Alkaline Type) |
| WCTE-100 |
Wafer Cu-TiW Hybrid Etchant (Acid Type) |
| PRD-20 |
Wafer Photoresist Developer (Positive) |
| PRD-K20 |
Wafer Photoresist Stripper (Negative) |
| PRS-20 |
Wafer Photoresist Stripper (Positive) |
| PRS-K20 |
Wafer Photoresist Stripper (Negative) |
| FPS-100 |
Wafer Photoresist Stripper (Negative), Inorganic Salt Type |
| WPS-100 Series |
Wafer Photoresist Stripper (Positive), Organic Solvent Type |
| Substrate Manufacturing, COF, Smart-IC, etc. | DFRD-100 |
DFR Developer (Carbonate Type) |
| LDDP-100 |
DFR Developer (TMAH Type) |
| DFS-101, DFS-300 |
DFR Stripper (Amine Type) |
| DPM-100 |
DFR/PR Soluble Stripper (DMSO Solvent Type) |
| DMP-100 |
Ni, Ni-Cr Sputter Seed Remover (COF, Probe Card) |
| FPE-600 Series |
Cu Etching Factor Improvement Additive (FPCB) |
| PIE-200 |
Polyimide Etchant |
| CRR-22 |
Metal Impurity Remover for Au, Pd Electroplating Solution (Cu, Ni) |
| FOC-100 |
VCM Flux Cleaner |
| TIM Thermal Grease | KC1-2 |
1.8 W/mK Class Thermal Grease (BLT: 22 μm) |
| KC2-2 |
2.5 W/mK Class Thermal Grease (BLT: 20 μm) |
| KN2-440 |
2.6 W/mK Class Thermal Grease (BLT: 20 μm) |
| KN1-15 |
3.0 W/mK Class Thermal Grease (BLT: 24 μm) |
| KC3-2 |
3.6 W/mK Class Thermal Grease (BLT: 22 μm) |
| KC4-3 |
4.5 W/mK Class Thermal Grease (BLT: 35 μm) |
| Adhesive for Electronic Materials | TA 6900 |
Die Attach, Thermosetting, Excellent Adhesion to FR4 and Si Die Materials |
| TA 6880 |
Housing Attach, Thermosetting, Excellent Adhesion to Molded Parts |
| TA 6800FC |
IR-Filter Attach, Thermosetting, Excellent Adhesion to Glass and PET Materials |
| TA 6520 |
Automotive Encapsulation, Thermosetting, Passed Automotive Electronics Reliability Testing |
| TA 7700DM |
Automotive Encapsulation, Thermosetting, Passed Automotive Electronics Reliability Testing |
| UA 8900 |
IR-Filter, UV Curing, Exceptional Adhesion to LCP and Glass Materials |
| UA 9201 |
Hole Sealing, UV Curing, Excellent Adhesion to Molded Parts |
| UA 9340 |
Lens Fixing, UV Curing, Excellent Adhesion to Glass and LCP Materials |
| UVA-HS3 F2 |
Solder Sealing, UV Curing, Excellent Adhesion to Metal Materials |
| Eco-friendly Cleaners | NRC-Series |
Eco-Friendly Cleaner, NMP Alternative (Organic Contaminants) |
| HSC-400 Series |
Industrial Organic Solvent Alternative Cleaner |
| Uniconex-7700 |
Eco-Friendly Cleaner, TCE & MC Alternative |
| EOC-Series |
Eco-Friendly Cleaner, Anone Alternative (Cyclohexanone-Based) |
| IRC-Series |
Eco-Friendly Cleaner, IPA Alternative |
| HSC-900 Series |
Eco-Friendly Cleaner, Fluorinated Precision Cleaner Alternative |
| SurTec Product | ZN-Blue-S |
Blue/White Zinc Hexavalent Chromate |
| SurTec 042 |
Temporary Corrosion Inhibitor Liquid Cleaner for Iron and Magnesium |
| SurTec 084 |
Surfactant for Spray Processes |
| SurTec 085 |
Reusable Surfactant |
| SurTec 086 |
Reusable Surfactant Spray |
| SurTec 089 |
Reusable Additive for Cleaning |
| SurTec 104 |
Multi-Purpose Liquid Cleaner |
| SurTec 108 |
Reusable Liquid Cleaner |
| SurTec 131 |
Reusable Liquid Cleaner |
| SurTec 136 |
Reusable Alkaline Liquid Cleaner |
| SurTec 138 |
Highly Concentrated Reusable Alkaline Cleaner |
| SurTec 140 |
Mild Alkaline Liquid Cleaner |
| SurTec 198 |
Highly Concentrated Alkaline Liquid Cleaner |
| SurTec 520 |
Plating and Chromate Sealer |
| SurTec 531 |
Reusable Corrosion Inhibitor |
| SurTec 533 |
Temporary Corrosion Inhibitor for Iron and Steel |
| SurTec 544 |
Black Chromate Finishing Agent |
| SurTec 555 |
Heat-Resistant Sealer |
| SurTec 650 |
Aluminum Trivalent Chromate |
| SurTec 650 RTU |
Aluminum Trivalent Chromate (Spray Type) |
| SurTec 650 Retouch Pen |
Trivalent Chromate Retouch Pen |
| SurTec 667 |
Highly Corrosion-Resistant Blue/White Zinc Trivalent Chromate |
| SurTec 680LC |
Natural Color Zinc Trivalent Chromate |
| SurTec 704 |
Cyanide-Free Alkaline Zinc Plating |
| SurTec 717 |
Electrolytic Zinc/Nickel Plating |
| SurTec 900 |
Defoamer |
| Cleaner | PCC-101H, 200H |
Electrolytic Alkaline Degreaser (Reel to Reel, Rack) |
| SFBC-100 |
Electrolytic Alkaline Degreaser (Low-Foaming) |
| CEC-100 |
Electrolytic Alkaline Degreaser (Low-Foaming, Cu Oxide Removal) |
| CBC-100 |
Alkaline Degreaser for Ultrasonic Cleaning (No Cu Damage) |
| CAC-100 |
Acidic Degreaser for Spray Application (No Cu Damage) |
| AI-1230, AI-1240 |
Electrolytic/Immersion Alkaline Powder-Type High-Speed Degreaser (LED, Connector) |
| AI-419 |
Ultrasonic and Immersion Alkaline Powder-Type Degreaser (LED, Connector) |
| PAC-200K, SAC-200 |
Acidic Degreaser for PCB, TAB, BGA |
| PAC-310X |
Neutral Degreaser for PCB, TAB, BGA, LED, AI |
| Etchant | SAT-500 |
Heat-Resistant Discoloration Agent for Ag |
| KCE-50 |
Soft Etchant for Cu Alloy |
| KCE-1000 |
Soft Etchant for Fe Alloy |
| BCE-100 |
3-Component Etching Additive (Low Turbidity) |
| MFE-5000 |
Hydrogen Peroxide-Based PCB-COF Soft Etchant |
| CME-200 |
Etchant for Cu Mesh |
| ALE-100, 100A |
Al Etchant (Acid Type) |
| Post-treatment CorrosionDiscoloration Inhibitor | AR-1(AT), AR-21 |
IC Lead Frame RBO Inhibitor (General Purpose) |
| TR-1 |
IC Lead Frame RBO Inhibitor (for PPF) |
| AR-51 |
PFAS Free Lead Frame RBO Inhibitor (General Purpose) |
| HP-1 |
PFAS Free Lead Frame RBO Inhibitor (Rough Cu) |
| HP-2 |
PFAS Free Lead Frame RBO Inhibitor (PPF) |
| PW-600 2T |
Displacement Inhibitor for Ag Plating (Low Cyanide) |
| SAT-200 |
Tarnish Inhibitor for Ag |
| CB-2001, CB-2021 |
Cu Anti-Oxidation, Tarnish Inhibitor |
| Au-XW |
Au Plating Sealing Agent for PCB |
| Au-Sealer 100 |
Au Plating Sealing Agent for PCB/Connectors |
| GOS-419, 700 |
Immersion Au Plating Sealing Agent |
| HRFT-100 |
Sn High-Temperature Discoloration Inhibitor |
| Stripper | MS-401 |
Sn and Sn/Pb Stripper |
| TIS-100, 200 |
Sn and Sn/Pb Stripper (No Cu Damage) |
| GS-500 |
Au Stripper (for PCB, Connectors) |
| NS-ERL |
Ni Stripper (for PCB, Minimizing Cu Attack) |
| SAU-100 |
Au Seed Stripper (for Au Bump) |
| AS-300 |
Ag Stripper (for Lead Frame Materials) |
| CS-100 |
Cu Stripper (for Lead Frame on Alloy 42) |
| PCS-240, 820 |
Cu Electrolytic/Immersion Rack Stripping Etchant |
