| Process |
Chemical |
purpose |
Feature |
| Dedreasing /Cleaning |
PAC-200 |
Acid cleaner for PCB, TAB, BGA |
Acid cleaner for PCB process before or after Cu plating to washing on the Cu surface. Useful for removing finger print, oxide PR residue. |
| PAC-310 |
Neutral claener PCB |
Neutral claener PCB process before or after Cu plating to washing on the Cu surface. Useful for removing finger print, oxide PR residue |
| Soft etching |
CPE-750 |
PCB soft Etchant (Hydrogen peroxide type) |
Soft Etchent for PCB and suited for pretreating of Dry film lamination |
| NPE-300 |
Sodium persulfate type Etchant |
Sodium persulfate type soft etchant for the pretreatment of PCB through-Hole before plating |
| SPS |
Sodium persulfate type Etchant |
Sodium persulfate type soft etchant for Cu electroless plating process |
| KCE-500 |
PCB soft Etchant (Hydrogen peroxide type) |
Soft Etchent for PCB process, preteatment of Dry film laminating |
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