 |
| Useful for Mo etching in TSP process Minimize side etching |
|
| |
 |
Cu/ITO, ITO etchant for general touch panel process.
Chemical to minimize Cu side etching and photo resist attack .
Possible for Non-crystal, crystal ITO
|
|
| |
 |
| Cu etchant on Ni/Cr layer for general Touch panel process.
Chemical to minimize Ni/Cr side etching photo resist attack
|
|
| |
 |
| Excellent cleaner for PSR ink, Ag-paste using organic solvent.
Use for silk screen cleaning and removing contaminated PSR-Ink of silk screen pattern area.
|
|
| |
 |
| ITO etching chemical
Minimize Metal pattern attack and DFR damage
|
|
| |
 |
| Inorganic type photo resist developer and easy to control solution by analysis |
|
| |
 |
| Inorganic type photo resist stripper free from Cu tarnish and damage |
|
| |
 |
| Inorganic type DFR developer |
|
| |
 |
| Amine(organic) type DFR stripper and possible for rapid strip by making fine fragment
|
|
| |
> Product > TOUCH
