| Process |
Chemical |
purpose |
Feature |
| Nickel plating |
E-Form |
PCB and electronic part |
High purity grade sulfamate nickel concentrate designed and manufactured specifically for use in electronic industry microlithography. |
| SN-1000,2000 |
Brightener for sulfamate nickel plating |
Agent of bright sulfamate nickel plating and can use high current density |
| SN-500 |
Brightener for sulfamate nickel plating |
Agent of semi-bright sulfamate nickel plating for PCB, leadframe |
| SN-100 |
Residual Stress reducer for sulfamate nickel plating |
Addition agent of bright nickel plating solution and suitable for electroformig, electronic part |
| NP-A |
Anti - pitter |
Anti pitter NP-A is surfactant of lower foaming for sulfamate nickel plating by adding small quantity |
| SN-pH |
pH adjust Agent |
Agent for adjusting(decreasing) of pH in sulfamate nickel plating |
| Gold plating |
KG-400 Process |
Gold plating Process for Ni Barrier |
Developed for Ni barrieir formation in gold plating |
| Au sealing agent |
Au-Sealler 100 |
Dipping type Au seal agent for gold plated |
Possible to be used by dipping type as a sealing agent for Au plating
Chemical solution having excellent feature in preventing anti-corrosion and discolor
of connector, switch, PCB |
> Product > CONNECTOR